Masterflex pumps provide very low shear, avoiding damage to the slurry polymer chains that can negatively alter removal rates, polishing uniformity, scratch density or depth. Flows come in contact with only the inside of one uninterrupted length of Style 100 SC high resilience-silicon composite pump tube element, providing for a smooth, seamless flow to prevent the agglomeration of slurry particles that can cause scratch defects and lower yields. Masterflex peristaltic pumps provide superior flow rate stability and metering accuracy in a totally closed system for contamination-free flow control. In these critical processes, the control and management of flows must rely on fluid delivery and dispense systems that provide precision at all times – to maintain process integrity and minimize scrap. Masterflex peristaltic pumps provide an accuracy of ☐.5% or better, and at consistent flow and pressure over extended operating periods.As wafer technology advances to smaller line widths, accurate control of liquid flow becomes increasingly important for attaining high yields. The stable fluid delivery provided by Masterflex pumps not only ensures a constant flow of slurry to the polishing pad, it also minimizes slurry, chemical and DI water waste.Īccuracy, dependability brings significant gains The pump’s nonintrusive design provides a straight flow path with no dead flow areas for slurry to agglomerate, harden, and contaminate the process. Optimum slurry performance enables superior wafer planarity, and Masterflex pumps helps provide for this through the precise control of slurry delivery and dispense. The pump’s low shear force is gentle on CMP slurries, and its variable speed operation allows for precise control of flow or pressure over a wide operating range to maintain process integrity. For CMP, Masterflex pumps provide the linearity and repeatability required for optimal point-of-use slurry flow dispense to the wafer during polishing.

Masterflex peristaltic pumps are highly suited for the high purity and corrosive chemical environments of the semiconductor industry. Variations in wafer thickness, increased defect densities, tool downtime and increased wafer scrap are just a few of the problems that can result from poor process flow control. When CMP tools do not dispense a consistent slurry rate onto the polishing substrate, it can have a highly negative impact on yields, chemical usage and material integrity. One of the most demanding applications is chemical mechanical planarization (CMP).

Semiconductor manufacturing demands liquid flows within process tools be precisely controlled at all times. Global Product Manager, Masterflex Bioprocessing, USA.

Gear and Positive Displacement Flowmeters.

Peristaltic pump controller minitube